User Manual TEC Controller (Thermoelectric-Cooling/ Peltier Element Controller)

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SWISS MADE (Thermoelectric-Cooling/ Peltier Element Controller) TEC-Family: TEC-1089 TEC-1090 TEC-1122 TEC-1123 TEC-1091 TEC-1092 Meerstetter Engineering GmbH Schulhausgasse Rubigen, Switzerland
Transcript
SWISS MADE (Thermoelectric-Cooling/ Peltier Element Controller) TEC-Family: TEC-1089 TEC-1090 TEC-1122 TEC-1123 TEC-1091 TEC-1092 Meerstetter Engineering GmbH Schulhausgasse Rubigen, Switzerland Phone: Website: Meerstetter Engineering GmbH (ME) reserves the right to make changes without further notice to the product described herein. Information furnished by ME is believed to be accurate and reliable. However typical parameters can vary depending on the application and actual performance may vary over time. All operating parameters must be validated by the customer under actual application conditions. Table of Contents 1 Introduction to the TEC-Family of Digital Temperature Controllers Getting Started, Step-by-Step Software Installation Mounting and Powering-Up the Peltier Controller Hardware and Status Verification Monitor Tab, Software Ergonomics / Organization Configuration Tab 'Operation', Transfer of Configuration Parameters Temperature Measurements Preparation Object (and Sink) Temperature Acquisition Connection of a Peltier Element Temperature Regulation / Digital Temperature Control Advanced Operation Charting and Data Logging Tempperature Stability Indication Two Channel Operation and Parallel Mode Selection Auto Tuning / System Optimization Modelization for Thermal Power Control Configurations and Parameter Activation Device Configurations Handling Firmware Updates Remote Control / Bus Control by Communication Protocol 'MeCom' Remote Control / Service Communication by TEC Service Software Scriptable Control by Lookup Table Processing (Expert Operation) Lookup Table Control from within TEC Service Software Instruction Set and Available Options Example Lookup Table Generation/Editing and Export Temperature Acquisition Hardware and Configuration (Expert Settings) Object and Sink Temperature Sensors and Input Configurations [optional] Use and Configuration of NTC Temperature Probes Calibration and Hardware Settings (Service Software 'Expert' Tab) Temperature Probes Assembly Temperature Acquisition ADC Circuitry Calibration Special Functions and Optional Hardware Optional Display Kit (DPY-1113) PBC (Platform Bus Connector) RES1 RES8 Control Signals FAN Control Feature Change Target Temperature using external Buttons Page 3 (59) 6.5 Misc Expert Settings Appendix 1 Status LEDs and Error Codes Page 4 (59) 1 Introduction to the TEC-Family of Digital Temperature Controllers This manual is written for products belonging to the TEC-Family of advanced thermoelectric cooling drivers / digital temperature controllers. All models are either based on the TEC-1092, which is a miniature Peltier controller, on the TEC-1091, which is a small Peltier controller, on the TEC-1089, which is a compact Peltier controller, or on the TEC-1122, which is a dual channel controller that shares the same architecture and microcontroller platform. To double output current, two channels of TEC based devices can be operated in parallel mode. All members of the TEC-Family can be used as temperature regulators (TEC controllers) or as power supplies, both in stand-alone and in remotely-controlled (RS232 TTL / RS485 / USB) operation. The TEC-1122 has been developed to work along the LDD-1121, an advanced laser diode driver / controller that shares the same communication bus and hardware architecture. Again, there are several LDD-1121-based devices available, forming the LDD-Family of products. TEC-Family Peltier Controllers LDD-Family Laser Diode Drivers Model TEC-1092 TEC-1091 TEC-1089-SV TEC-1122-SV TEC-1090-HV TEC-1123-HV LDD-1124-SV LDD-1121-SV LDD-1125-HV Description ±1.2 A / ±9.6 V, Miniature, Single Channel ±4 A / ±21 V, Small, Single Channel ±10 A / ±21 V, Compact, Single Channel 2x (±10 A / ±21 V), Dual Channel ±16 A / ±30 V, Compact, Single Channel 2x (±16 A / ±30 V), Dual Channel A / 0-15 V, Low-Ripple CW and Pulsed-Mode Operation 0-15 A / 0-15 V, Low-Ripple CW and Pulsed-Mode Operation 0-30 A / 0-27 V, Low-Ripple CW and Pulsed-Mode Operation Table A. Overview over the Meerstetter TEC and LDD Families of advanced controllers. Meerstetter Engineering GmbH is specialized in supporting custom laser solutions. TEC-Family devices are designed to work in support of LDD-Family laser diode drivers. Meerstetter Engineering offers turn-key solutions of systems comprising up to four LDD and TEC devices. These solutions are based on the LTR-1200 Rack Enclosure which includes a human-machine interface (HMI) with further advanced communication and local control features as well as modular cooling and power supply options. 2 Getting Started, Step-by-Step For the first usage, we recommend you to use out new Setup Guide. This document is available on our website. For more advanced users, we recommend you the following Step-by-Step guide in this document. In the following steps, setting up a TEC as a stand-alone single-channel temperature controller driving a Peltier element is described. Unless stated otherwise, 'TEC' designates TEC-1092-based, TEC based, TEC-1089-based and TEC-1122-based models. Bullet points () designate actions, tick boxes () feedbacks/reactions, and arrows () further information. Page 5 (59) 2.1 Software Installation Step 1 Install USB Driver (Not necessary for Ethernet Communication in case of LTR-1200) Start up a PC running Windows 7, Windows 8 or Windows 10 Use a Mini-USB cable to connect the TEC board to the Service PC Windows recognizes the USB interface and if necessary - installs a (serial interface) driver In case Windows cannot locate the FTDI USB driver by itself, download the executable from: This installation does not require the TEC to be powered, yet (the isolated USB interface is bus-powered) Step 2 Install Service Software Please ensure the Service PC meets the following minimum requirements: o.net Framework 4.6.x * o Microsoft Visual C Redistributable (x86) ** o Display resolution: 1024x768 or greater Copy the latest version of the Service Software executable (e.g. TEC Service [version].exe) to the PC and launch it All required software can be downloaded from our website. *Online/web installer for.net Framework 4.6.x: and restart PC **32bit version vc_redist.x86.exe: https://www.microsoft.com/en-us/download/details.aspx?id=48145 (Use Microsoft Visual C Redistributable (x86) for Service Software Versions 2.70) The present Service Software is a tool that has been programmed by Meerstetter Engineering for device configuration, monitoring and debugging. It is being made available to customers for OEM device evaluation, commissioning and operation. The Service Software will display a 'Device connected, establishing communication' message in the bottom left corner and the red indicator will confirm 'Communication error with device' (the TEC is not yet powered) Page 6 (59) Figure 1. TEC Service Software Icon and screen at first startup (USB connected, TEC unpowered) 2.2 Mounting and Powering-Up the Peltier Controller Step 3 Mount onto System Carrier Plate Use screws to fasten the TEC controller to the system Step 4 For initial tests / operation at intermittent, low power, it is not necessary to firmly screw the TEC onto a plate. Placing it on a metal plate / heat sink should be sufficient Connect to Power Supply Connect (VIN) and (GND) to the outputs of the external power supply Do not connect the Peltier element, yet Step 5 Power up Peltier Controller Enable power supply and check device status Either the green or the red status LED should be blinking / lit Step 6 Successful Connection Check active connection between the TEC controller and its Service Software The square in the bottom left corner of the Service Software should be green and 'Connected' The 'Device Status' indicator should be amber and 'Ready' A color-coded indicator informs about the current device status, refer to Appendix 1 for more information Page 7 (59) 2.3 Hardware and Status Verification Step 7 Identify Firmware and Hardware Versions of your Peltier controller Locate the corresponding group box in the 'Monitor' tab Take note of the processor and hardware versions Check the serial number matches the sticker on your TEC Step 8 Check 'Power Supplies and Temperature' Status Locate the corresponding group box in the 'Monitor' tab Check the input voltage matches the one of the external power supply Check the internal Medium Voltage and 3.3V supplies are working at nominal voltage Check the Device Temperature is reasonable Step 9 Check 'Error Status' Locate the corresponding group box in the 'Monitor' tab Take note of the three error indicators. 0s are shown when no error is present Error Number designates the error condition; Error Instance normally indicates the channel concerned. Error Parameter is additional information helping the software engineers with diagnosis and remote debugging. If applicable, a brief Error Description is displayed in the corresponding field. Please consult Appendix 1 for more detail on TEC controller and laser diode driver error codes Page 8 (59) 2.4 Monitor Tab, Software Ergonomics / Organization Step 10 Check Channel 1 Status with no Temperature Probes or Peltier Element Connected Locate Channel 1 status group boxes in the 'Monitor' tab: o o o o o 'CH1 Temperature Measurement' 'CH1 Temperature Control 'CH1 Output Stage Monitoring' 'CH1 Temperature Controller PID Status' 'CH1 Temperature Measurement' Note that these boxes display status / monitoring information, currently: o o o o o Object and sink temperatures are static (no probes connected, sink temperature set to 'fixed') Temperature control parameters are static (TEC not in controller mode) Actual output current and voltage are zero (no load connected, output stage disabled) Temperature controller PID values are zero (TEC not in controller mode) Temperature measurement sensor raw ADC values are at end of range (no probes connected) and thus displayed sensor resistances meaningless Observe that the arrangement of top three group boxes follows an input-control-output pattern Note that the bottom two group boxes display more in-depth status of PID control and AD conversion / probes resistance Object and sink sensor raw ADC values are converted into object and sink sensor resistances for better readability. These conversions depend on actual hardware configurations (such as reference resistors, probe currents, etc.) Step 11 Check Channel 2 Status Locate Channel 2 status group boxes in the 'Monitor' tab Observe that most Service Software tabs are organized in three columns, where the first one is dedicated to CH1 and the second one to CH2 (TEC-1122-based only). For reasons of clarity, only CH1 settings are highlighted in this manual. Unless stated otherwise, they are valid for both CH1 and CH2. Page 9 (59) 2.5 Configuration Tab 'Operation', Transfer of Configuration Parameters Step 12 Move from the Monitor Tab to a Configuration Tab, Check General Operating Mode Switch to 'Operation' Locate the three group boxes to the right Please check 'General Operating Mode' is set to 'Single (Independent)' Refer to chapter 3.3 for detail on general operating modes [optional] Please check 'RS485 Channel 1 Settings' are compatible with your control system Refer to chapter 3.9 for information on RS485 communication [optional] Attribute a unique 'Device Address' if you are operating multiple TEC controllers or laser diode drivers on the same platform bus, e.g. mounted into an LTR-1200 rack enclosure The Operation tab is a configuration tab (not a monitoring tab, such as the 'Monitor' tab). In configuration tabs, each parameter displays an actual value next to a blank field for entering a new value New values need to be transferred to the device by clicking 'Write Config' in the bottom right corner of the Service Software The values transferred to the TEC are considered static. They are saved to non-volatile memory ('Flash') and remain valid upon device reset Most operational parameters become active immediately, some hardware configuration parameters require a device Reset to become active. They are designated by a star: * (see chapter 3.6) Page 10 (59) Step 13 Check Output Stage Control Source, Enable, Current/Voltage and Limits Locate the corresponding group boxes on the Operation tab Please take the time to check factory settings are set according to the illustration on the right It is important that 'Static Current/Voltage' mode is selected as output stage control input There are three sources that can control a channel's output stage: 'Static Current/Voltage' makes the channel behave like a DC power-supply (with set current and voltage, temperatureindependent). Values are read from non-volatile memory. If 'Live Current/Voltage' is selected, current and voltage values are taken from the device's volatile memory ('RAM') which can be continuously updated by remote-control. In the 'Temperature Controller' mode the output current for cooling/heating is calculated by the on-board firmware as a function of temperature and other information 'CH1 Output Stage Enable' activates / suppresses channel power output. Static OFF and ON settings are saved to nonvolatile memory ('Flash') and remain active upon a device power cycle. 'Live OFF/ON' will read the Enable status from the devices volatile memory ('RAM') and will return to default status OFF upon a device power cycle or reset 'CH1 Output Stage Static Current/Voltage Control Values' are read when the TEC controller channel is used as a DC powersupply. The sign of the 'Set Current**' parameter determines polarity of both current and voltage. (The sign of the 'Set Voltage' parameter is ignored.) 'CH1 Output Stage Limits' are important safety settings that limit the TEC's output power to protect the connected modules Both static and live settings can be configured on the fly by bus-control, i.e. by 'MeCom' communication protocol over a serial connection (USB or RS485). The TEC Service Software does not permit to write live/ram parameters. See chapter 3.9 Remote Control / Bus Control by Communication Protocol 'MeCom' for more information on static and live settings. Please consult the 'MeCom' communication protocol specification document 5136 for more detail on TEC-Familyspecific bus-controlled live/ram parameters (IDs 50'000). Page 11 (59) 2.6 Temperature Measurements Preparation Step 14 Check CH1 Object Temperature Measurement Settings Switch to tab 'Object Temperature' Please take the time to familiarize with the current temperature measurements settings (see bottom illustration on the right) Object temperature measurement uses a dedicated 23bit A/D conversion Acquisition circuitry can accommodate three sensor types Pt100, Pt1000, or NTC. The selected type is indicated in the in the group box 'CH1 Object Temperature Measurement Limits' (here: NTC) Acquisition hardware settings / calibration data are sensitive to accidental misconfiguration and thus available in a separate, password-protected 'Expert' tab (see chapter 4). The group box 'CH1 Object Temperature Measurement Limits' indicates the currently readable sensor resistance range (hardware) and the correspondingly calculated temperatures (software) Please note that you can adjust the temperature measurement output to calibrate your sensor [optional] Object temperature measurement output is user-modifiable by the 'Temperature Offset' and 'Temperature Gain' parameters. This provides a mean for sensor response adjustment, if required Step 15 Set Object Temperature Safety / Plausibility Data Locate CH1 Actual Object Temperature Error Limits Check that reasonable error threshold values are set Max Temp Change is a parameter needed for the identification of physically non-plausible changes in object temperature, such as they occur for faulty temperature sensors, or if elements contributing to the system's thermal inertia have dislodged. The evolution of the object temperature is constantly monitored. If a step (steep slope, jump, or drop) in object temperature, faster than the 'Max Temp Change' rate occurs, the unit will go into error status. The TEC controller is immune to noise transients (shorter than 300ms) in the object temperature acquisition circuitry. The lower and upper thresholds are safety limits. If the measured object temperature falls outside them, the TEC controller will enter error status and switch off its outputs. Again, these safety limits are immune to noise transients. Page 12 (59) Step 16 [optional] Enter CH1 Object NTC Sensor Characteristics (e.g. NTC B 25/ K, R 25 10k) Locate CH1 Object NTC Sensor Characteristics In case a PTC sensor (Pt100, Pt1000) was chosen to acquire object temperature, its characteristics according to DIN EN are used (internally saved) In case an NTC sensor was chosen to acquire object temperature, please take the time to check/enter its characteristics Sensor (thermistor) characteristics are modeled according to the Steinhart-Hart equation Factory settings for default NTC object temperature probe (NTC B25/ k, linearization range 0-60 C) In case a different NTC object temperature probe is used, the values in 'CH1 Object NTC Sensor Characteristics' must be filled in Please refer to chapter 5.2 for information on entering NTC characteristics Step 17 [factory-set] Sink Temperature Measurement Bypassing Switch to tab 'Sink Temperature' Locate CH1 Sink Temperature General Check that a realistic 'Fixed Value' is chosen as sink temperature Monitoring the temperature at the heat sink side of a Peltier element allows for optimized power modeling. If this is not required, a fixed sink temperature can be assumed If heat sink temperature monitoring is required, a sensor must be connected and configured prior to activation, otherwise out-ofrange errors will be produced It if the sink temperature may be colder than about 9 C and this is an allowed condition, it is recommended to disable the Upper ADC Limit Error. If this error is disabled, the sink temperature can go below 9 C, but it does not throw an error. The temperature measurement will stay still somewhere around - 10 C. The disadvantage is that it does not detect it, when no sensor is connected. Page 13 (59) Step 18 [optional] Check CH1 Sink Measurement Settings Switch to tab 'Sink Temperature' Please note that the user interface for sink temperature measurement configuration and operation is very similar to the one for object temperature configuration Sink temperature measurement uses an MCU-integrated 12bit ADC Acquisition circuitry can only accommodate NTC type sensors * Temperature Offset and Gain are user-settable calibration values for sensor calibration * Error Thresholds are safety settings, Max Temp Change is plausibility data * Sink NTC Sensor Characteristics are always relevant (i.e. they cannot be superseded by Pt100/Pt1000 internal data) Sensor type indication at the right side of the current tab * NTC characteristics are defined by three [temperature, resistance] points extracted from the sensor's data sheet Current factory settings: NTC B25/ k, 0-60 C * Sink Temperature Selection and Fixed Temperature allow sensor bypassing Currently, external Sink Temperature Measurement is not active and the Fixed Value of 25 C is fed to the system. See chapter 5 for more information on Object and Sink Temperature Measurement Page 14 (59) 2.7 Object (and Sink) Temperature Acquisition Step 19 [case 1: factory-selected NTC probes] Have Temperature Probes Assembly at Hand Proceed as follows if you wish to use factory-selected NTC probes for object (and sink) temperature acquisition: NTC B25/ K, R25 10k Make sure temperature probe(s) on cable and plug are assembled according the corresponding datasheet. Make sure temperature measurement settings are entered according to Step 16 (object) and Step 18 (sink) Step 20 [case 2: factory-set Pt100 or Pt1000 probes] Have Temperature Probes Assembly at Hand Proceed as follows if you wish to use Pt100 or Pt1000 probes for object temperature acquisition.
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